Advances in Interconnect Technologies: An International Journal(AITIJ) http://airccse.com/aitij/index.html ********************************************************** Call for papers *************** Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and significant contributions relating to the theory, design, performance and reliability of interconnect, including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate the development of latest technology in industry and academia. High quality review papers and short communications are also acceptable. Research areas suitable for publication include, but are not limited to the following fields: Emerging Materials CNT/ Graphene Interconnects Modeling and Simulation Testing RFIC Optical Interconnects Wireless Interconnects Microstrip Lines Analog and Mixed Signals Dedicated Software and Systems for Developing Interconnect Technology On-Chip and Off-Chip Interconnects EMC/EMI FPGA/ASICs Fabrication Techniques Neural Networks Parasitics Issues Optimization Techniques Paper Submission **************** Authors are invited to submit papers for this journal through E-mail: aitijjournal@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal. Important Dates **************** Submission Deadline : March 30, 2024 Notification : April 30, 2024 Final Manuscript Due : May 07, 2024 Publication Date : Determined by the Editor-in-Chief For other details please visit http://airccse.com/aitij/index.html